Step 3 of 4

Lumaspect Reflow™From placed components to soldered board.

A module in development for reflow soldering with a controlled thermal profile, part of the assembly flow.

Preliminary designPreliminary design (drawings LS-DRW-REFLOW, simulation). No prototype; the thermal profile shown comes from a model, not a measurement.

Still image of the simulation — Concept simulation. The continuous transfer between machines shows the vision of the platform, not a capability that has been demonstrated.

01Bench product

Lumaspect Reflow™

Takes the board through preheat, reflow and cooling with a controlled thermal profile.

Load
Preheat
Soak
Reflow
Cooling
Unload

Subsystems

Drag to rotate, scroll or pinch to zoom.

Wireframe design model, not a finished product.

Convection chamber with heaters above and below.
Cooling with a flap and a fan.
Flux fumes to an outlet with a trap.
The profile shown is illustrative, to be validated with thermocouples.

02Data sheet

Data sheet in brief.

The same fields for the four steps, so they can be compared.

In the design
Target to validate
Future option
To be defined

Data sheet	Lumaspect Make™	Lumaspect Apply™	Lumaspect Reflow™	Lumaspect Check™
Function	Trace isolation, drilling and outline cutting of prototype PCBsTarget to validate	Solder paste dispensing and component placementIn the design	Reflow soldering with a controlled thermal profileIn the design	2D optical inspection with AI of assembled boardsIn the design
Input	Single or double-sided copper-clad panelTarget to validate	Bare clean PCB, components on tape or trayIn the design	PCB with paste and placed componentsIn the design	Soldered PCBIn the design
Output	PCB without plated holes, to be cleaned before assemblyTarget to validate	PCB with unreflowed paste and placed componentsIn the design	Soldered and cooled PCBIn the design	Result per component (OK, to review), images, recordIn the design
Bench configuration	To be definedTo be defined	Apply™ L3: 806 × 706 × 451 mm, front drawerIn the design	Reflow™ L3: 700 × 560 × 340 mm, chamber with drawerIn the design	Vision™ L3: about 545 × 500 × 310 mm, about 14 kg, front drawerIn the design
Possible in-line integration	To be definedTo be defined	Module of the L3+ mini line (concept); in-line L5 version (design, development on hold)Future option	Indexed chamber of the L3+ mini line (concept); L5 tunnel oven (design, development on hold)Future option	Vision™ L4 and L5 in line (designs, development on hold); module of the L3+ mini line (concept)Future option
Work area or board size	To be definedTo be defined	350 × 250 mmIn the design	350 × 250 mmIn the design	From 50 × 50 to 350 × 250 mmTarget to validate
Main subsystems	X/Y/Z axes, spindle, probe, spoil board, extractionTarget to validate	CoreXY, piston dispenser, nozzle with vacuum and rotation, top and bottom cameras, feedersIn the design	Stainless chamber, heaters above and below, convection, cooling, 4 thermocouples, fume outletIn the design	CoreXY with Z, IMX296 camera, 25 mm lens, RGBW ring, Raspberry Pi 5In the design
Design data needed	Gerber of the traces, Excellon drill file, outline (from KiCad or other CAD)Target to validate	Bill of materials (BOM), placement file (CPL), paste layer (Gerber); IPC-2581 and ODB++ as a targetTarget to validate	Profile for the paste alloy (from the board program)Target to validate	Placement file (CPL) and one good boardIn the design
Power and services	230 V; dust extraction required; power to be definedTo be defined	230 V; vacuum from an internal pump, no compressed air; power to be definedTarget to validate	230 V 10 A; fume extractionTarget to validate	100–240 V, 100 W; Ethernet and Wi-FiTarget to validate
Development status	Concept under evaluationIn the design	Preliminary design; smallest component 0603 imperial to validateTarget to validate	Preliminary design; profile from a model, not measuredTarget to validate	Prototype in development; 2D in development, 3D under evaluationIn the design

Values marked “in the design” are set in the drawings but not yet measured on a prototype.

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03In depth

How it works, in detail.

How it works

The board stays still in the drawer and the chamber air follows the program: preheat, soak, reflow above the melting point of the alloy, cooling. The fans spread the heat above and below the board.

The chart on this page comes from a simple thermal model and explains the phases. Peak and time above melting will be measured with thermocouples on the user’s board.

Architecture and subsystems

Stainless chamber insulated with mineral fibre, plenums above and below with perforated plates, sheathed heaters, radial fans with motors out of the heat, drawer with stainless tray, cooling fan and flap, fume outlet with trap, electronics behind a ventilated double wall.

Operating flow

Drawer open, board on the tray pins, drawer closed → preheat → soak → reflow → cooling with the flap open → below 50 °C the drawer unlocks → board ready for Check™.

Integration with the other machines

The profile comes from the board program, the same one used by Apply™ and Check™. In the in-line vision (L3+) the chamber becomes indexed, with insulated doors and a separate cooling station: a board goes in only if there is a free place after the oven. It is not demonstrated yet.

Expected input and output formats

Input: paste alloy and board from the program. Output: the soldered board and the record of the profile measured by the thermocouples.

Calibration and maintenance

Profiling with thermocouples on the board (two probe sockets in the drawer), cleaning condensed flux from the perforated plates, replacing the trap cartridge, checking the thermal cut-out.

Technical limits and open questions

To measure: uniformity across the board, heating and cooling rates, outer temperature, effectiveness of the fume trap.

Air atmosphere; nitrogen is not planned.

Open-source projects

Used in the project

None so far.

Under evaluation

None so far.

04Cheat sheet

The summary to print.

Cheat sheet

Lumaspect Reflow™

From placed components to soldered board.

Rev. A · 2026-10-12Preliminary design

Function: Bench reflow soldering with a controlled profile.
Input → output: PCB with paste and components → soldered and cooled PCB.
Operating cycle: Load → preheat → soak → reflow → cooling → unload below 50 °C
Requirements: 230 V 10 A · fume extraction · profile for the paste alloy
Limits: Profile to be measured with thermocouples · air only · uniformity to verify
Status of the specifications: Preliminary design. Illustrative profile, no measured thermal performance.

05The other steps

Four machines, one flow.

Concept under evaluation

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Get news on the prototype and on chances to join the first demonstrations.

Lumaspect Reflow™From placed components to soldered board.

Used in the project

Under evaluation

Lumaspect Make™

Lumaspect Apply™

Lumaspect Check™

Notify me about Reflow