Step 4 of 4

Lumaspect Check™From assembled board to visual inspection.

An inspection system that combines optical capture, geometric measurement and AI to find assembly and soldering anomalies and document the results.

Prototype in developmentPrototype in development: inspection and capture software working on synthetic images and a simulated machine; machine designed (Vision™ L3), prototypes for pioneers planned from spring 2027.

Still image of the simulation — Concept simulation. The continuous transfer between machines shows the vision of the platform, not a capability that has been demonstrated.

01Bench product

Lumaspect Check™

Photographs the board field by field and compares each component with the program; when it is not sure, it says so.

Load
Datums
Field capture
Analysis
Result
Record

Subsystems

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Wireframe design model, not a finished product.

2D inspection of presence, position, rotation and polarity; solder bridges in development.
When it is not sure, the operator decides.
3D extensions (fringe projection) under evaluation.
Not an electrical test, and it does not see hidden joints (under QFN and BGA).

The prototype behind Check™ is Lumaspect Vision™ L3: how it is built and how to take part in its development.

02Data sheet

Data sheet in brief.

The same fields for the four steps, so they can be compared.

In the design
Target to validate
Future option
To be defined

Data sheet	Lumaspect Make™	Lumaspect Apply™	Lumaspect Reflow™	Lumaspect Check™
Function	Trace isolation, drilling and outline cutting of prototype PCBsTarget to validate	Solder paste dispensing and component placementIn the design	Reflow soldering with a controlled thermal profileIn the design	2D optical inspection with AI of assembled boardsIn the design
Input	Single or double-sided copper-clad panelTarget to validate	Bare clean PCB, components on tape or trayIn the design	PCB with paste and placed componentsIn the design	Soldered PCBIn the design
Output	PCB without plated holes, to be cleaned before assemblyTarget to validate	PCB with unreflowed paste and placed componentsIn the design	Soldered and cooled PCBIn the design	Result per component (OK, to review), images, recordIn the design
Bench configuration	To be definedTo be defined	Apply™ L3: 806 × 706 × 451 mm, front drawerIn the design	Reflow™ L3: 700 × 560 × 340 mm, chamber with drawerIn the design	Vision™ L3: about 545 × 500 × 310 mm, about 14 kg, front drawerIn the design
Possible in-line integration	To be definedTo be defined	Module of the L3+ mini line (concept); in-line L5 version (design, development on hold)Future option	Indexed chamber of the L3+ mini line (concept); L5 tunnel oven (design, development on hold)Future option	Vision™ L4 and L5 in line (designs, development on hold); module of the L3+ mini line (concept)Future option
Work area or board size	To be definedTo be defined	350 × 250 mmIn the design	350 × 250 mmIn the design	From 50 × 50 to 350 × 250 mmTarget to validate
Main subsystems	X/Y/Z axes, spindle, probe, spoil board, extractionTarget to validate	CoreXY, piston dispenser, nozzle with vacuum and rotation, top and bottom cameras, feedersIn the design	Stainless chamber, heaters above and below, convection, cooling, 4 thermocouples, fume outletIn the design	CoreXY with Z, IMX296 camera, 25 mm lens, RGBW ring, Raspberry Pi 5In the design
Design data needed	Gerber of the traces, Excellon drill file, outline (from KiCad or other CAD)Target to validate	Bill of materials (BOM), placement file (CPL), paste layer (Gerber); IPC-2581 and ODB++ as a targetTarget to validate	Profile for the paste alloy (from the board program)Target to validate	Placement file (CPL) and one good boardIn the design
Power and services	230 V; dust extraction required; power to be definedTo be defined	230 V; vacuum from an internal pump, no compressed air; power to be definedTarget to validate	230 V 10 A; fume extractionTarget to validate	100–240 V, 100 W; Ethernet and Wi-FiTarget to validate
Development status	Concept under evaluationIn the design	Preliminary design; smallest component 0603 imperial to validateTarget to validate	Preliminary design; profile from a model, not measuredTarget to validate	Prototype in development; 2D in development, 3D under evaluationIn the design

Values marked “in the design” are set in the drawings but not yet measured on a prototype.

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03In depth

How it works, in detail.

How it works

The board stays still; the optical head moves over it and photographs 20 × 15 mm fields under controlled light. The images are straightened and aligned in software, then compared component by component with the program and with a good board.

Two separate models: one measures in the images (presence, position, rotation, polarity), the other decides the result. When confidence is low the board goes to the operator instead of getting an automatic result.

Architecture and subsystems

CoreXY on MGN9 rails with Z on the head, global shutter camera, 25 mm lens, polarised RGBW ring, Raspberry Pi 5 with Klipper and the capture process. Analysis in the cloud or on site with the same security.

Operating flow

Program from the placement file and a good board → load in the drawer → datums → field capture → analysis → result per component and per board → record with the images.

Integration with the other machines

It uses the same program as Apply™ and Reflow™; in the in-line vision it receives the board from Reflow™ and hands it on with its result. The in-line versions (Vision™ L4 and L5) are designs with development on hold.

Expected input and output formats

Input: CPL (KiCad, Altium or CSV) and a good board; IPC-2581 and ODB++ as a target. Output: result, images, PDF report and exportable data.

Calibration and maintenance

Calibration target for scale and focus, light check, axis repeatability checked with the camera. Routine gantry maintenance and optics cleaning.

Technical limits and open questions

It only sees what is visible from above: it does not check joints under QFN and BGA and does not replace X-ray or electrical tests.

Solder bridges and tombstones are in development; 3D measurement (fringe projection, Vision™ L5 design) is under evaluation. False alarms and missed defects have to be measured on the pioneers’ test sets.

Open-source projects

Used in the project

OpenCV · Geometry and markers in the inspection software, behind the project’s interfaces.
Klipper · Motion firmware of the L3 machine.
Voron · CoreXY kinematics used as a design reference; parts redesigned.

Under evaluation

ONNX Runtime · Running the trained models on the machine and on the server.
Mainsail and Fluidd · Web interfaces for motion calibration.
OpenFlexure Microscope · Raspberry Pi camera for measurement, focus stacking.

04Cheat sheet

The summary to print.

Cheat sheet

Lumaspect Check™

From assembled board to visual inspection.

Rev. A · 2026-10-12Prototype in development

Function: 2D optical inspection with AI of assembled boards, with a result per component.
Input → output: Soldered PCB → OK or to review, images, record.
Operating cycle: Program from the CPL → load → datums → fields → analysis → result and record
Requirements: CPL and one good board · 100–240 V · network for cloud or local server
Limits: Only surfaces visible from above · not an electrical test · bridges and 3D not available yet
Status of the specifications: Prototype in development. L3 batch values are design targets.

05The other steps

Four machines, one flow.

Concept under evaluation

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Lumaspect Check™From assembled board to visual inspection.

Used in the project

Under evaluation

Lumaspect Make™

Lumaspect Apply™

Lumaspect Reflow™

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